You Searched For: KMG


23  results were found

Sort Results

List View Easy View
SearchResultCount:"23"
Description: Hydrochloric Acid, 37% Polybottle, Formula: HCl, CAS Number: 7647-01-0,used in SC-2 solutions to remove surface metallic contamination from silicon wafers. 40lb
Catalog Number: 71009-358
Supplier: KMG

Description: Hydrochloric Acid 37% Cleanroom LP, Standard, Container: Poly bottle, Formula: HCl, CAS Number: 7647-01-0, key ingredient to remove surface metallic ions by forming soluble metal chlorides. 10lb
Catalog Number: 71009-324
Supplier: KMG

Description: Buffered Oxide Etchants are used to etch thin films of silicon dioxide and shape contact and via openings
Catalog Number: 89400-770
Supplier: KMG

Description: Ammonium Hydroxide 29% Cleanroom MB, Container: Poly Bottle, Formula: NH3, CAS Number: 1336-21-6, Storage: 0 Deg F - 80 Deg F, used in a SC-1 solution to remove organics and particles from the surface of a wafer. 8lb
Catalog Number: 71009-320
Supplier: KMG

Description: Sulfuric Acid 96% Cleanroom MB, Sulfuric acid, our high purity process chemical offering, is used in piranha solutions for organic removal. It is available in bottles, drums, totes and bulk. 771lb.
Catalog Number: 71009-532
Supplier: KMG

Description: Xylene Cleanroom LP -Amber Bottle, Formula: C8H10, It is used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions. 13lb
Catalog Number: 71009-384
Supplier: KMG

Description: Ammonium fluoride 40% in aqueous solution MB
Catalog Number: 89400-748
Supplier: KMG

Description: 2-Propanol ≥99.5%, Cleanroom® LP for the electronics industry
Catalog Number: KM431-200440
Supplier: KMG

Description: Nitric Acid 69.5% Cleanroom LP, Cotainer: Poly bottle, Formula: HNO3, CAS Number: 7697-37-2, strong oxidizing agent, used to oxidize silicon to silicon dioxide and to dissolve metals to metal nitrates. 7lb
Catalog Number: 71009-340
Supplier: KMG

Description: 2-Propanol ≥99.8%
Catalog Number: 71009-372
Supplier: KMG

Description: Buffered Oxide Etchants are used to etch thin films of silicon dioxide and shape contact and via openings
Catalog Number: 89400-756
Supplier: KMG

Description: Potassium Hydroxide 45% Cleanroom LP, Standard, Container: Poly bottle, Formula: KOH, CAS Number: 1310-58-3, used to etch silicon. The crystalline orientation of the silicon greatly affects the etch rate making potassium hydroxide an anisotropic etchant. 12lb
Catalog Number: 71009-346
Supplier: KMG

Description: Acetone Cleanroom MB, Container: Poly Botttle, Formula: CH3COCH3, CAS: 67-64-1, can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover. (2-Propanone Dimethyl ketone DMK Propanone), 7lb
Catalog Number: 71009-318
Supplier: KMG

Description: Hydrogen Peroxide 30% Cleanroom MB, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-334
Supplier: KMG

Description: Hydrogen Peroxide 30% Gigabit*, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-336
Supplier: KMG

Description: CR-16, is a Nitric Acid based chrome etchant used for photolithography masks, semiconductor and MEMS processes. It is designed to provide minimum undercutting, maximum critical dimension control and repeatability
Catalog Number: 10803-036
Supplier: KMG

1 - 16 of 23