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Description: Hydrogen Peroxide 30% Cleanroom MB, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-334
Supplier: KMG

Description: Hydrogen Peroxide 30% Gigabit*, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-336
Supplier: KMG

Description: CR-16, is a Nitric Acid based chrome etchant used for photolithography masks, semiconductor and MEMS processes. It is designed to provide minimum undercutting, maximum critical dimension control and repeatability
Catalog Number: 10803-036
Supplier: KMG

Description: Hydrogen peroxide 30,00 - 32,00% LP
Catalog Number: 71009-366
Supplier: KMG

Description: Acetone Cleanroom MB, Container: Poly Botttle, Formula: CH3COCH3, CAS: 67-64-1, can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover. (2-Propanone Dimethyl ketone DMK Propanone), 7lb
Catalog Number: 71009-318
Supplier: KMG

Description: Potassium Hydroxide 45% Cleanroom LP, Standard, Container: Poly bottle, Formula: KOH, CAS Number: 1310-58-3, used to etch silicon. The crystalline orientation of the silicon greatly affects the etch rate making potassium hydroxide an anisotropic etchant. 12lb
Catalog Number: 71009-346
Supplier: KMG

Description: Buffered Oxide Etchants are used to etch thin films of silicon dioxide and shape contact and via openings
Catalog Number: 89400-756
Supplier: KMG

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