Sulfuric acid ≥96%, Cleanroom® MB for the electronics industry
Supplier: KMG
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Danger
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Synonyms:
Hydrogen sulfate
64104
64103
64071
71009-380CS
293.72
USD
71009-380
KM460-064103
71009-532
Sulfuric acid ≥96%, Cleanroom® MB for the electronics industry
Sulfuric acid
Sulfuric acid is used in semiconductor processing to remove residual organic contamination prior to metalization steps.
Store at less than 109⁰ F
Formula:
H₂SO₄ MW: 98.08 g/mol Boiling Pt: ∼335 °C (1013 hPa) Melting Pt: 3 °C Density: 1.84 g/cm³ (20 °C) Storage Temperature: Ambient |
MDL Number:
MFCD00064589 CAS Number: 7664-93-9 EINECS: 231-639-5 UN: 1830 ADR: 8,II Merck Index: 14,08974 |
Specification Test Results
Assay (H2SO4) | 95.00 to 97.00 % |
Assay (H2O) | 3.00 to 5.00 % |
Color | 10 APHA |
Appearance | Conforms |
Substance Reducing KMnO4 | Conforms |
Chloride (Cl) | 100 ppb |
Nitrate (NO3) | 100 ppb |
Phosphate (PO4) | 200 ppb |
Aluminum (Al) | 10.0 ppb |
Antimony (Sb) | 1.0 ppb |
Arsenic (As) | 1.0 ppb |
Barium (Ba) | 10.0 ppb |
Beryllium (Be) | 10.0 ppb |
Bismuth (Bi) | 10.0 ppb |
Boron (B) | 10.0 ppb |
Cadmium (Cd) | 10.0 ppb |
Calcium (Ca) | 10.0 ppb |
Chromium (Cr) | 10.0 ppb |
Cobalt (Co) | 5.0 ppb |
Copper (Cu) | 10.0 ppb |
Gallium (Ga) | 10.0 ppb |
Germanium (Ge) | 10.0 ppb |
Gold (Au) | 5.0 ppb |
Iron (Fe) | 10.0 ppb |
Lead (Pb) | 10.0 ppb |
Lithium (Li) | 10.0 ppb |
Magnesium (Mg) | 10.0 ppb |
Manganese (Mn) | 10.0 ppb |
Molybdenum (Mo) | 10.0 ppb |
Nickel (Ni) | 10.0 ppb |
Niobium (Nb) | 10.0 ppb |
Potassium (K) | 10.0 ppb |
Silicon (Si) | 10.0 ppb |
Silver (Ag) | 10.0 ppb |
Sodium (Na) | 10.0 ppb |
Strontium (Sr) | 10.0 ppb |
Tantalum (Ta) | 10.0 ppb |
Thallium (Tl) | 10.0 ppb |
Tin (Sn) | 10.0 ppb |
Titanium (Ti) | 10.0 ppb |
Vanadium (V) | 10.0 ppb |
Zinc (Zn) | 10.0 ppb |
Zirconium (Zr) | 10.0 ppb |
0.5μ Particle Count | 25 par/ml |
1.0μ Particle Count | 10 par/ml |
10 par/ml |
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