Hydrogen peroxide 30%, Cleanroom® MB for the electronics industry

Supplier: KMG
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64025
71009-334CS 657.83 USD
71009-334
Hydrogen peroxide 30%, Cleanroom® MB for the electronics industry
Hydrogen peroxide

Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.

Formula: H₂O₂
MW: 34.01 g/mol
Boiling Pt: ∼107 °C (1013 hPa)
Melting Pt: < 0 °C
Density: 1.11 g/cm³ (20 °C)
Storage Temperature: Ambient
MDL Number: MFCD00011333
CAS Number: 7722-84-1
EINECS: 231-765-0
UN: 2014
ADR: 5.1,II

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Specification Test Results

Assay (H2O2) 30.00 to 32.00 %
Assay (H2O) 68.00 to 70.00 %
Color 6 APHA
Appearance Conforms
Free Acid 0.60 μeq/g
Total Organic Carbon 20,000 ppb
Chloride (Cl) 60 ppb
Nitrate (NO3) 200 ppb
Phosphate (PO4) 200 ppb
Sulfate (SO4) 200 ppb
Aluminum (Al) 10.0 ppb
Antimony (Sb) 5.0 ppb
Arsenic (As) 5.0 ppb
Barium (Ba) 10.0 ppb
Beryllium (Be) 10.0 ppb
Bismuth (Bi) 10.0 ppb
Boron (B) 10.0 ppb
Cadmium (Cd) 10.0 ppb
Calcium (Ca) 10.0 ppb
Chromium (Cr) 10.0 ppb
Cobalt (Co) 10.0 ppb
Copper (Cu) 10.0 ppb
Gallium (Ga) 10.0 ppb
Germanium (Ge) 10.0 ppb
Gold (Au) 10.0 ppb
Iron (Fe) 10.0 ppb
Lead (Pb) 10.0 ppb
Lithium (Li) 10.0 ppb
Magnesium (Mg) 10.0 ppb
Manganese (Mn) 10.0 ppb
Molybdenum (Mo) 10.0 ppb
Nickel (Ni) 10.0 ppb
Niobium (Nb) 10.0 ppb
Potassium (K) 10.0 ppb
Silicon (Si) 10.0 ppb
Silver (Ag) 10.0 ppb
Sodium (Na) 10.0 ppb
Strontium (Sr) 10.0 ppb
Tantalum (Ta) 10.0 ppb
Thallium (Tl) 10.0 ppb
Tin (Sn) 10.0 ppb
Titanium (Ti) 10.0 ppb
Vanadium (V) 10.0 ppb
Zinc (Zn) 10.0 ppb
Zirconium (Zr) 10.0 ppb
0.2μ Particle Count 1,000 par/ml
0.3μ Particle Count 1,000 par/ml
0.5μ Particle Count 25 par/ml
1.0μ Particle Count 10 par/ml
10 par/ml

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