Hydrochloric acid 37%, Cleanroom® LP for the electronics industry

Supplier: KMG
Danger

Synonyms: Muriatic acidHydrochloric acid solution

200238 64010 64009
71009-514EA 12541.67 USD
71009-514 71009-500 71009-324
Hydrochloric acid 37%, Cleanroom® LP for the electronics industry
Hydrochloric acid

In semiconductor processing, the presence of metallic impurities on the wafer can lead to early dielectric breakdown. Hydrochloric acid is a key ingredient to remove surface metallic ions by forming soluble metal chlorides.

Storage: <80⁰ F

Formula: HCl
MW: 36.46 g/mol
Boiling Pt: 110 °C (1013 hPa)
Melting Pt: –30 °C
Density: 1.18 g/cm³ (20 °C)
Storage Temperature: Ambient
MDL Number: MFCD00011324
CAS Number: 7647-01-0
EINECS: 231-595-7
UN: 1789
ADR: 8,II

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Specification Test Results

Assay (HCl) 37.00 - 38.00%
Color 10 APHA
Appearance Conforms
Free Halogens Conforms
Phosphate (PO4) 50 ppb
Sulfate (SO4) 300 ppb
Sulfite (SO3) 800 ppb
Aluminum (Al) 100.0 ppb
Antimony (Sb) 5.0 ppb
Arsenic (As) 5.0 ppb
Barium (Ba) 100.0 ppb
Boron (B) 50.0 ppb
Cadmium (Cd) 100.0 ppb
Calcium (Ca) 100.0 ppb
Chromium (Cr) 100.0 ppb
Cobalt (Co) 50.0 ppb
Copper (Cu) 50.0 ppb
Gallium (Ga) 100.0 ppb
Germanium (Ge) 100.0 ppb
Gold (Au) 100.0 ppb
Iron (Fe) 100.0 ppb
Lead (Pb) 25.0 ppb
Lithium (Li) 100.0 ppb
Magnesium (Mg) 100.0 ppb
Manganese (Mn) 100.0 ppb
Nickel (Ni) 50.0 ppb
Potassium (K) 100.0 ppb
Silicon (Si) 100.0 ppb
Silver (Ag) 50.0 ppb
Sodium (Na) 100.0 ppb
Strontium (Sr) 100.0 ppb
Tin (Sn) 100.0 ppb
Titanium (Ti) 100.0 ppb
Zinc (Zn) 30.0 ppb
0.5μ Particle Count 50 par/ml
1.0μ Particle Count 10 par/ml

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