Buffered oxide etch 6:1 (BOE 6:1) semiconductor grade, with surfactant
Supplier: Transene
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Danger
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000BOE61S-QT
000BOE61S-GAL
76540-935CS
201.79
USD
76540-935
76541-076
Buffered oxide etch 6:1 (BOE 6:1) semiconductor grade, with surfactant
Buffered oxide etch
Buffered Oxide Etchant 6:1 with surfactant is a moderate-speed etchant for oxide films. 6:1 ratio of ammonium fluoride: HF. Contains non-PFAS surfactant to improve wet-out of high surface energy substrates or penetration of critical geometries.
Boiling Pt:
103-105 °C Melting Pt: -35 °C Density: 1.11…1.12 g/cc |
UN:
2817 ADR: 8, 6.1,II |
Specification Test Results
Color | ≤ 10 APHA |
Aluminum | ≤ 3.1 ppb |
Antimony | ≤ 10 ppb |
Arsenic | ≤ 2 ppb |
Barium | ≤ 0.5 ppb |
Beryllium | ≤ 1 ppb |
Bismuth | ≤ 1 ppb |
Boron | ≤ 5 ppb |
Cadmium | ≤ 1 ppb |
Calcium | ≤ 3 ppb |
Chloride | ≤ 2 ppm |
Chromium | ≤ 2 ppb |
Cobalt | ≤ 2 ppb |
Copper | ≤ 5 ppb |
Gallium | ≤ 2 ppb |
Germanium | ≤ 2 ppb |
Gold | ≤ 2 ppb |
Iron | ≤ 5 ppb |
Lead | ≤ 2 ppb |
Lithium | ≤ 1 ppb |
Magnesium | ≤ 1 ppb |
Manganese | ≤ 2 ppb |
Molybdeum | ≤ 1 ppb |
Nickel | ≤ 1 ppb |
Nitrate | ≤ 3 ppm |
Phosphate | ≤ 0.4 ppm |
Potassium | ≤ 2 ppb |
Silver | ≤ 1 ppb |
Sodium | ≤ 5 ppb |
Strontium | ≤ 1 ppb |
Sulfate | ≤ 0.5 ppm |
Thallium | ≤ 2 ppb |
Tin | ≤ 2 ppb |
Titanium | ≤ 5 ppb |
Vanadium | ≤ 2 ppb |
Zinc | ≤ 2 ppb |
Zirconium | ≤ 2 ppb |
Particle >0.5 | ≤ 100 Particle/ml |
Particle >1.0 | ≤ 15 Particle/ml |
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