Hydrogen peroxide 30.00 - 32.00% LP

Supplier: KMG

64023 64022
71009-520EA 2620.62 USD
71009-520 71009-366
Hydrogen peroxide 30.00 - 32.00% LP
Hydrogen peroxide

Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.

Formula: H₂O₂
MW: 34.01 g/mol
Boiling Pt: ∼107 °C (1013 hPa)
Melting Pt: < 0 °C
Density: 1.11 g/cm³ (20 °C)
MDL Number: MFCD00011333
CAS Number: 7722-84-1
UN: 2014
ADR: 5.1,II

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Specification Test Results

Assay (H2O2) 30.00 - 32.00%
Color 10
Appearance Conform
Free Acid 0.500 µeq/g
Total Organic Carbon 20,000 ppb
Chloride 200 ppb
Phosphate 1500 ppb
Sulfate 3000 ppb
Aluminum 30 ppb
Antimony 5 ppb
Arsenic 5 ppb
Barium 10 ppb
Beryllium 10 ppb
Bismuth 10 ppb
Boron 10 ppb
Cadmium 10 ppb
Calcium 80 ppb
Chromium 15 ppb
Cobalt 10 ppb
Copper 20 ppb
Gallium 20 ppb
Germanium 20 ppb
Gold 10 ppb
Iron 30 ppb
Lead 100 ppb
Lithium 10 ppb
Magnesium 30 ppb
Manganese 10 ppb
Molybdenum 10 ppb
Nickel 10 ppb
Niobium 10 ppb
Potassium 400 ppb
Silicon 100 ppb
Silver 20 ppb
Sodium 100 ppb
Strontium 20 ppb
Tantalum 15 ppb
Thallium 20 ppb
Tin 500 ppb
Titanium 20 ppb
Vanadium 10 ppb
Zinc 25 ppb
Zirconium 10 ppb
0.20µ Particle Count 1000 par/ml
0.50µ Particle Count 100 par/ml
1.00µ Particle Count 10 par/ml

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