Buffered oxide etch 50:1
Supplier: KMG
62062
89400-756CS
729.85
USD
89400-756
Buffered oxide etch 50:1
Buffered oxide etch
Buffered oxide etchants are used to etch thin films of silicon dioxide and shape contact and via openings.
Specification Test Results
Assay (HF) | 0.90 - 1.10% |
Assay (NH4F) | 38.70 - 39.70% |
Appearance | Conform |
Chloride | 2500 ppb |
Nitrate | 5000 ppb |
Phosphate | 500 ppb |
Sulfate | 1000 ppb |
Aluminum | 20 ppb |
Antimony | 5 ppb |
Arsenic | 5 ppb |
Barium | 10 ppb |
Boron | 10 ppb |
Cadmium | 10 ppb |
Calcium | 30 ppb |
Chromium | 10 ppb |
Cobalt | 10 ppb |
Copper | 10 ppb |
Gallium | 10 ppb |
Germanium | 10 ppb |
Gold | 10 ppb |
Iron | 50 ppb |
Lead | 20 ppb |
Lithium | 10 ppb |
Magnesium | 20 ppb |
Manganese | 10 ppb |
Nickel | 10 ppb |
Potassium | 25 ppb |
Silver | 10 ppb |
Sodium | 50 ppb |
Strontium | 10 ppb |
Tin | 20 ppb |
Titanium | 20 ppb |
Zinc | 10 ppb |
0.5µ Particle Count | 160 par/ml |
1.0µ Particle Count | 8 par/ml |
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